SM-1441 Wafer Cleaning Machine-Shenzhen SAM Electronic Equipment Co., Ltd.

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SM-1441 Wafer Cleaning Machine

Product Model:

SM-1441

Product Description

This equipment primarily employs a high-speed centrifugal design, coupled with dual-fluid cleaning and static elimination systems, to achieve thorough drying and cleanliness of the products being cleaned. It is mainly used for the cleaning of incoming components for camera assemblies, such as lenses, lens mounts, and other washable parts. The equipment features an integrated touch-screen control module and is equipped with an FFU unit and a precision oil-film filtration system. It boasts powerful programming capabilities and a user-friendly operating interface.

Product Details

Machine features:
1. Adjustable product placement fixture, capable of cleaning 5-inch, 8-inch, and 12-inch products (customized according to the size of the customer’s product fixture).
2. The operating procedures can be customized and adjusted according to actual job requirements, making them convenient, quick, and more user-friendly.
3. Rotary spray arm design: The spray arm rotates during both washing and spinning, preventing recontamination of the product after spinning.
4. High-speed centrifugal design, with a counterclockwise speed adjustment range of 10–2000 (r/min).
5. The upper and lower spray bars can be manually switched to operate independently or simultaneously (for both gas and pure water).
6. The device comes with a two-stage air filtration system that ensures cleaner air after connection, with a filtration level of 0.01 μm.
7. The device comes with a built-in purified water source filtration system, ensuring that the DI water delivered to the connected equipment is even cleaner, with a filtration level of 1 μm.
8. The internal environment of the machine can reach Class 10 under static conditions, more effectively reducing secondary contamination after product cleaning.
9. Key components of the water and gas lines are made of SUS316 material, further ensuring the cleanliness of the water and gas sources.
10. The entire machine features a SUS304 mirror-finish stainless steel body that is resistant to acid and alkali corrosion, environmentally friendly, and easier to clean.
11. Patent-protected cleaning chamber design with secondary stainless steel FFU air filtration ensures open-loop discharge of DI water and air, thereby preventing secondary pollution.
12. The 4–12-inch wafer fixture tray is machined using a precision grinding machine to ensure minimal amplitude during high-speed rotation and stable operation.
13. Patent-designed spray bar nozzle with uniform atomization and consistent spray pressure.

Machine parameters:

Device dimensions (mm)	550(L) × 750(W) × 1650(H)	Pure water inlet diameter	Φ12mm hose
Fixture Specifications	Customized according to customer products	Drainage outlet diameter	Outer diameter 30mm, inner diameter 25mm, storm pipe
Outlet diameter	4″ (110mm) × 2 units (requires enhanced ventilation, with airflow velocity exceeding 3 m/s)	Air source inlet diameter	Φ12mm PU air hose
Power supply	Three-phase five-wire power supply	Power consumption	During cleaning: approximately 1.5 kW/h (machine in normal production)
Total power	2KW	Gas supply	0.40-0.7Mpa
Centrifugal speed	10–2000 rpm	DI water supply demand	Pressure > 0.25 MPa; Flow rate > 10 L/min
Motor power	1500W	Drive mode	Servo motors (Mitsubishi/Panasonic/Delta)
Pure water consumption	0-4 L/min	Environmental filtering method	0.3μm filtration efficiency: 99.9995%
Gas consumption	50-100L/Min	Machine net weight	Approximately 220 kg
Air filtration method	5 μm × 1 (primary filtration); 0.01 μm × 1 (precision filtration); 0.01 μm × 1 (precision filtration)