SMFC-6200SC Online Cleaning Machine-Shenzhen SAM Electronic Equipment Co., Ltd.

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SMFC-6200SC Online Cleaning Machine

Product Model:

SMFC-6200SC

Product Description

This equipment is designed for the removal of solder paste residues prior to molding for high-capacity packaging devices such as Flip-Chip, SIP, FCBGA, and FCCSP. It has been reliably deployed in the cleaning of various high-reliability semiconductor components, including fingerprint sensors, camera modules, communication devices, acoustic RF components, and power control units. The SMFC-6200SC boasts core technologies and patents, and offers a variety of optional features to help users optimize their processes and control costs.

Product Details

Machine features:

1. Two-stage structural design—modular, prevents fluid leakage, easy maintenance, and high product cleanliness;

2. Dual-network belt structure—compatible with cleaning of both carrier substrates and bare boards, ensuring no damage;

3. Condenser structure—low soap solution loss and high recovery efficiency;

4. Fully automatic saponifier concentration detection and addition—precisely controlling the concentration and level of the cleaning solution;

5. Pressure Monitoring—Real-time acquisition and digitization of parameter indicators ensure more stable equipment performance.

6. Thermal radiation drying—thermal radiation, accuracy ±0.1℃, stepless temperature adjustment;

7. Preheat DI water—this helps avoid shrinkage stress and reduces thermal shock from water temperature changes.

8. Automatic leakage detection and alarm system—monitors leakage conditions in real time;

9. Automatic overtemperature alarm function—dual protection for the heating element to prevent dry burning;

10. Code-reading system—data reading and integration;

11. Monitored real-time filtration system—high filtration accuracy and rapid water quality improvement;

12. Highly reliable connection method—high strength, high tightness, and easy to assemble and disassemble;

13. Human-friendly and user-friendly software interface—dynamic visuals, intuitive, and concise;

14. SESC/GEM Function—Digitalization and Systematization.

Machine parameters:

Conveying speed	10-150 cm/min adjustable speed	Entry/exit board direction	Left in, right out.
Conveying height	890-940mm	Working width	600 mm
Water consumption	8–14 L/min (DI water) (MAX) (Adjust according to actual cleaning conditions)	Control	Adopts an industrial control all-in-one machine and Mitsubishi PLC control.
Power requirements	AC 380V, 3-phase, 50Hz, 186.2 kW, 284A	Product cleaning dimensions	600mm (W) × 400mm (L) × 15mm (H)
Device dimensions	6200mm (L) × 1900mm (W) × 2370mm (H)