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SM-8160 Ultrasonic Spray Stencil  Cleaning Machine
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  • SM-8160 Ultrasonic Spray Stencil  Cleaning Machine

SM-8160 Ultrasonic Spray Stencil Cleaning Machine

Product Model:

SM-8160


Product Description

This ultrasonic spray cleaning machine is primarily designed for cleaning SMT stencil boards in the electronics industry, using water-based cleaning fluids. It employs the industry’s most advanced cleaning technology to achieve 100% cleanliness while also protecting the environment.
The machine consists of a frame, a spray system, an ultrasonic system, a rinsing system, a lifting mechanism, a drying system, and a water circulation and filtration system. The machine primarily uses electricity as its energy source. Operators manually place the mesh screens into the cleaning chamber, set the desired parameters—including spray duration, ultrasonic intensity, drying time, and other relevant settings—on the touch screen, and then press the start button. The machine will then automatically perform spray cleaning, ultrasonic cleaning, rinsing, and drying of the mesh screens. Once the programmed cleaning cycle is complete, the machine will automatically stop and reset itself, ready for the next cleaning operation. This machine is a new, high-performance, fully automatic cleaning device that greatly simplifies the cleaning process for operators. The auxiliary consumables used by the equipment are water, environmentally friendly water-based cleaning agents, and PP cotton filter cartridges—all of which pose no safety risks.
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Product Details


Machine features: 
1. Innovative patented design: Near-touch ultrasonic cleaning combined with spray rinsing—no need to soak the mesh screen. 
2. The ultrasonic transducer is positioned 1–2.5 mm away from the steel mesh, and the cleaning fluid flows between them while the transducer scans both up and down to eliminate blind spots. 
3. During the lifting process, the mesh plate is quickly dried by high-pressure air nozzles, thereby resolving the bottleneck in water-based cleaning and drying. 
4. Quickly and efficiently clean the fine printing apertures and solder paste/adhesive on the stencil’s printing areas. 
5. The solder paste cleaning cycle is approximately 10 minutes, and the adhesive cleaning cycle is less than 15 minutes. 
6. Fully automatic PLC control, with dual-programming mode, simple button-operated interface, safe and reliable performance, and easy maintenance. 
7. Design and configure a circulating filtration system for MPC cleaning technology that features low operating costs and is environmentally friendly. 
8. One-touch operation—entire cleaning process is fully automated, with automatic addition and drainage of rinse solution requiring no manual intervention. The equipment features low energy consumption, minimal operating noise, zero pollution, and is energy-efficient and environmentally friendly. It boasts an all-stainless steel construction and occupies a small footprint. 
9. Integrated cleaning, rinsing, and drying functions. Liquid drainage and parameters for cleaning and rinsing can be set via the human-machine interface.

 

Machine parameters:

Recommended cleaning agent

Water-based cleaning agent SM-6000FCS

Device weight

 420KG

Total power

 10KW

Ultrasound power/frequency

1.5 kW / 40 kHz

Air source pressure

0.5–0.7 MPa

Spray pressure

0.15–0.25 MPa

Rinse tank capacity

  30L

Cleaning fluid tank capacity

  30L

Voltage/Frequency

380V/50Hz

Maximum cleaning range

740mm (W) × 740mm (L) × 40mm (H)

Device external dimensions

1300mm (L) × 850mm (W) × 2130mm (H)