SM-HPC-300 Wafer High-Pressure Cleaning Machine-Shenzhen SAM Electronic Equipment Co., Ltd.

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SM-HPC-300 Wafer High-Pressure Cleaning Machine

Product Model:

SM-HPC-300

Product Description

This equipment is a high-precision, high-performance wet-processing device used in semiconductor manufacturing, particularly in the fields of advanced packaging and wafer-level packaging. It is applied for flux and particle cleaning in bumping processes, and can also be used for bottom-gap flux and particle cleaning in CoWoS applications.

Product Details

Device features:

1. Achieves excellent cleaning performance when used with hot deionized water, two-fluid systems, ultra-pure CO₂ water, and N₂.

2. Specially designed high-pressure nozzles that do not damage delicate structures on the wafer surface, such as copper pillars and solder balls.

3. Dual-arm manipulator and dual chamfering device to improve cleaning UPH.

4. The nozzle pressure can reach up to 4,000 PSI and the angle is adjustable.

5. Compatible with 8/12-inch wafers

6. Compatible with AGV & OHT, and supports SECS/GEM connectivity.

Device parameters

Basic Information	Double-chamber or quad-chamber	Hourly capacity	≥24 pieces/hour/cavity
Loading and unloading device	Open-box wafer boxes, FOUPs, SMIFs, etc.	Process flow	HPC, Soft Spraying, HDI, Nitrogen Treatment
Robotic arm	Single-unit dual-arm robotic arm	Drying method	Nitrogen drying, rotary drying
Wafer size	6 to 12 inches	Equipment utilization	95%
Wafer thickness	Standard thickness	Wafer breakage rate	Less than 1/20,000
Chuck	Vacuum Chuck / Clamp-Type Chuck	Equipment footprint	1850 mm long × 1992 mm wide × 1943 mm high (excluding air intake and exhaust)